Advanced Copper Foil
Circuit Foil
Markets

Printed Circuit Fabrication

Product Description Application Roughness (Rz)  
TW-YE Standard Shiny Foil with Zinc,
HTE Grade 3
FR-4 Multilayer 5 - 14 µm
TWS High Bond Foil with Zinc,
HTE Grade 3
HTg, BT, Polyimide Multilayer 5 - 14 µm
TWLS Low Loss Foil with Zinc,
HTE Grade 3
High Speed Low Loss Multilayer and RF, Microwave Designs 4 - 8 µm
BF-TZA Ultra Low Loss Foil,
Zinc and Arsenic Free
High Speed Low Loss Multilayer and RF, Digital Applications <= 3.1 µm
TZA Low Profile,
Zinc and Arsenic Free
Halogen-free and Phenolic Cured Resin Systems 4 - 15 µm
TZA-B Low Profile,
Zinc and Arsenic Free
Superior Oxidation Resistance for Halogen-free Resin Systems 5 - 9 µm
DTH-TW Carrier Supported Foil, DoubleThin 5 µm, 7 µm and 9 µm for Very Fine Line and HDI Circuit Boards 4.5 - 6.5 µm
DTH-TZA Carrier Supported Foil, DoubleThin 2 µm, 3 µm and 5 µm for HDI Circuit Boards and IC Packaging <= 2.5 µm
BF-TZA-FX Flex Copper Foil, Low Profile,
Zinc and Arsenic Free
Flexible Circuits <= 3.1 µm
TZA-FX Flex Copper Foil, Low Profile,
Zinc and Arsenic Free
Flexible Circuits 4 - 12 µm
BF-HFZ Very Low Profile,
Zinc Free
For the manufacture of PTFE Circuit Boards 2 - 3 µm
BF-ANP Almost No Profile Our Flattest Copper Foils with Highest Data Transfer 1.3 - 1.6 µm
BF-HFI-LP2 HVLP, Zinc Free Inner Layer CCL Foil/Low Signal Loss, High Speed Digital <= 3.1 µm
ACF2 & ACF3 Aluminum-bonded Copper Foil Printed Circuit Board -
ACF-Screen Coper Foil with Poly Carrier Printed Circuit Board -