Advanced Copper Foil
Market Segment

Printed Circuit Fabrication

Product Description Application Roughness JIS (Rz)  
TZA Low Profile, Zinc and Arsenic Free Halogen-free and Phenolic Cured Resin Systems 4 - 6 µm
TWLS Low Loss Foil with Zinc, HTE Grade 3 High Speed, Low Loss Multilayer and RF, Microwave Designs 5 - 7.5 µm
BF-TZA Ultra Low Loss Foil, Zinc and Arsenic Free High Speed, Low Loss Multilayer and RF, Microwave Designs ≤ 2.5 µm
BF-NN
BF-NN-HT
Super Flat Profile Copper Foil for Reduced Signal Losses Ultra Low Loss Substrates including PPE, PPO & PTFE ≤ 1.1 µm
BF-ANP Almost No Profile Our Flattest Copper Foils with Highest Data Transfer ≤ 1.3 µm
BF-HFI-LP2 HVLP, Zinc Free Inner Layer CCL Foil, Low Signal Loss, High Speed Digital ≤ 2.5 µm
DTH-NF
DTH-ANP
Ultrathin/Very Smooth Carrier Supported Copper Foil for Fine Line Spacing Low Loss Substrates (PPE/PPO), BT and Halogen-free High Tg Epoxy Resin Systems ≤ 0.9 µm
≤ 1.2 µm
DTH-N-TZA Ultrathin Carrier Supported Copper Foil for Fine Line Spacing Bismaleimide-Triazine (BT) and Halogen-free High Tg Epoxy Resin Systems ≤ 1.8 µm
TZA-B Low Profile, Zinc and Arsenic Free Superior Oxidation Resistance for Halogen-free Resin Systems ≤4.2 µm
BF-TZA-FX Flex Copper Foil, Low Profile, Zinc and Arsenic Free Flexible Circuits ≤2.5 µm
TZA-FX Flex Copper Foil, Very Low Profile, Zinc and Arsenic Free Flexible Circuits 4.1 - 6.7 µm
ACF2
ACF3
Aluminum-bonded Copper Foil Printed Circuit Board -
ACF Steel Steel-bonded Copper Foil Printed Circuit Board -
ACF Screen Copper Foil with Poly Carrier Printed Circuit Board -