Advanced Copper Foil
Circuit Foil

Products

Product Description Application Roughness (Rz)  
TW-YE Standard Shiny Foil with Zinc,
HTE Grade 3
FR-4 Multilayer 5 - 12 µm
TWS High Bond Foil with Zinc,
HTE Grade 3
BT, Polyimide Multilayer 5 - 15 µm
TWLS Low Loss Foil with Zinc,
HTE Grade 3
High Speed Low Loss Multilayer and RF, Microwave Designs 7 - 8 µm
BF-TZA Ultra Low Loss Foil,
Zinc and Arsenic Free
High Speed Low Loss Multilayer and RF, Digital Applications 2.5 µm
TZA Low Profile,
Zinc and Arsenic Free
Halogen-free and Phenolic Cured Resin Systems 4 - 8 µm
TZA-B Low Profile,
Zinc and Arsenic Free
Superior Oxidation Resistance for Halogen-free Resin Systems 4 - 8 µm
DTH-TW Carrier Supported Foil, DoubleThin 5 µm, 7 µm and 9 µm for Very Fine Line and HDI Circuit Boards 4.5 - 6.5 µm
DTH-TZA Carrier Supported Foil, DoubleThin 2 µm, 3 µm and 5 µm for HDI Circuit Boards and IC Packaging 2.5 µm
BF-TZA-FX Flex Copper Foil, Low Profile,
Zinc and Arsenic Free
Flexible Circuits 2.5 µm
TZA-FX Flex Copper Foil, Low Profile,
Zinc and Arsenic Free
Flexible Circuits 4 - 9 µm
BF-HFZ Very Low Profile,
Zinc Free
For the manufacture of PTFE Circuit Boards 2 - 4 µm
Primer Coated Foils Almost No Profile Our Flattest Copper Foils with Highest Data Transfer 1.3 - 2 µm
BF-HFI-LP2 HVLP, Zinc Free Inner Layer CCL Foil/Low Signal Loss, High Speed Digital 1.5 - 3 µm
TWS-B-YE RTF High Bond Foil with Zinc Inner Layer Foil/High Tg Laminates 5 - 14 µm
TWS-LP4-YE Very Low Profile with Zinc Inner Layer Foil for High Density, Fine Lines 5.1 µm
HFZ-B Low Profile, Zinc Free Inner Layer Foil for PTFE Applications 5.1 µm
BF-Plainstainproof VLP Foil, Zinc and Arsenic Free For Battery and Shielding Applications, No Treatment 1 - 3 µm
ACF2 & ACF3 Aluminum-bonded Copper Foil Printed Circuit Board -