Advanced Copper Foil
Circuit Foil

Ultra Smooth - HVLP

Product Description Application Roughness (Rz)  
DTH-TZA Carrier Supported Foil, DoubleThin 2 µm, 3 µm and 5 µm for HDI Circuit Boards and IC Packaging <= 2.5 µm
BF-TZA-FX Flex Copper Foil, Low Profile,
Zinc and Arsenic Free
Flexible Circuits <= 3.1 µm
BF-HFI-LP2 HVLP, Zinc Free Inner Layer CCL Foil/Low Signal Loss, High Speed Digital <= 3.1 µm