Market Segment
Copper Clad Manufacturing
| Product | Description | Application | Roughness JIS (Rz) | |
|---|---|---|---|---|
| TZA-B | Low Profile, Zinc and Arsenic Free | Superior Oxidation Resistance for Halogen-free Resin Systems | ≤4.2 µm | |
| BF-HFI-LP2 | HVLP, Zinc Free | Inner Layer CCL Foil, Low Signal Loss, High Speed Digital | ≤ 2.5 µm | |
| BF-TZA | Ultra Low Loss Foil, Zinc and Arsenic Free | High Speed, Low Loss Multilayer and RF, Microwave Designs | ≤ 2.5 µm | |
| BF-NN BF-NN-HT |
Super Flat Profile Copper Foil for Reduced Signal Losses | Ultra Low Loss Substrates including PPE, PPO & PTFE | ≤ 1.1 µm | |
| BF-ANP | Almost No Profile | Our Flattest Copper Foils with Highest Data Transfer | ≤ 1.3 µm |