ACF-Screen™ is comprised of a Protective Poly release film adhered to a sheet of copper foil. It provides protection of the copper surface throughout the entire cycle of PCB lamination. ACF-Screen utilizes an inert adhesive which results in a residue-free copper surface during processing. The release film will uncouple during the lamination cycle, allowing for easy removal during break-down.

For example, we apply this release film to 9 μm copper foil to protect the surface and to allow for better handling during the layup process. There is no longer a need for expensive copper foil carriers.

Benefits

Improve Your Yields

• Protect the copper surface
• Eliminate Epoxy Spots
• Reduce Pits and Dents due to airborne particulate
• Buffers the Copper

Improve Your Productivity

• Speeds up the Layup Process
• Improves handling of thin Copper Foils
• Suitable for Automated Handling Systems
• Can replace expensive Copper/Aluminum/Copper and Aluminum/Bonded/Copper products
• Replaces DoubelThin carrier supported foils

Specifications

ACF-Screen is available in different copper foil types and thicknesses, with two types of poly release film:

• Standard copper, HTE (IPC Grade-3) for conventional FR-4 circuit boards
• High bond strength copper, for BT and Polyimide
• And Very Low Profile copper, for advanced HSLL applications