ACF2: This product is comprised of one piece of copper foil and one panel of aluminum. It is designed as a carrier sheet for the top or bottom copper layer in an MLB. The loose copper sheet is attached to the aluminum carrier with an inert adhesive.

ACF3: This product is comprised of two pieces of copper foil and one panel of aluminum. It can be used as the top and bottom copper layers on a multiple MLB stackup.

Specifications

Copper Foil
ACF is available with different copper foil types:

• Standard copper, HTE (IPC Grade-3) for conventional FR-4 circuit boards
• High bond strength copper, for BT and Polyimide
• And Very Low Profile copper, for advanced HSLL applications

ACF is available in different copper foil thicknesses:

Thickness
9 µm	0.25 oz
12 µm	0.375 oz
18 µm	0.5 oz
35 µm	1.0 oz
70 µm	2.0 oz

Aluminum
ACF Aluminum is available as follows:

Grade	Thickness
3000-series	.007"	0.18 mm
	.010"	0.25 mm
	.015"	0.38 mm

Adhesive
ACF is built with an "inert adhesive" that becomes weaker with heat. After the lamination cycle, the aluminum or poly separators are easily broken-down.

Panel Sizes
Panels are available in sizes 12" x 18" through 25" x 43".

Tooling Configuration
All panel sizes are available with standard multi-line tooling (0.188" offset in short dimension). Other configurations are available on special order basis.